
In industries where pressure, temperature, and reliability can’t be compromised, AIC’s DBX – diffusion bonded heat exchangers offer a next-generation solution. Also known as Printed Circuit Heat Exchangers (PCHE), DBXs are engineered for exceptional thermal performance, compactness, and endurance in even the harshest operating environments.
engineered for tough conditions - withstand high pressures (up to 1000 barg) and extreme temperatures (from cryogenic levels up to 800°c).
compact and lightweight - microchannel technology allows a footprint up to 6 times smaller than traditional shell and tube heat exchangers.
DBX heat exchangers are built using diffusion bonding, a solid-state metal joining process where atomic diffusion under heat and pressure forms a seamless, defect-free structure. The result is unmatched durability, heat transfer performance, and resistance to thermal and mechanical stress.
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With decades of experience in heat exchanger engineering, AIC S.A. brings advanced know-how to the development of diffusion bonding and microchannel heat exchanger technologies. While our DBX line is newly introduced to the market, it benefits from our in-house design and manufacturing capabilities — ensuring solutions that are engineered for performance, safety, and long-term durability, ready to meet the most demanding thermal challenges.
Our in-house engineering and manufacturing capabilities ensure every DBX solution delivers superior performance, safety, and longevity — customized for your toughest thermal challenges.
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Heat exchangers can be used in a variety of industries to help enhance productivity, efficiency, and safety in industrial processes. At AHE, we help industries define challenges and deliver custom-made products and solutions that make a difference for their businesses. Let us know how we can help transform your heat exchange operations.